main feature:
l Suitable forall kinds of high-power LED lamp bead packages with coated metal chips；
l Strong moisturizing ability and good weldwettability；
l The solder joint physical connection performanceis reliable, the residue is very small, and the reliability is high.
l ?Usingtin-bismuth high-temperature solder powder, it can be effectively used forhigh-temperature electronic component soldering or circuit board or integratedmodule requiring secondary reflow soldering.
Best printing performance
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
